• This comprehensive product series finds extensive utilization across industrial sectors, including automotive manufacturing, railway transportation, elevator construction, container manufacturing, naval industries, metal fabrication, machinery production, electronics assembly, plastic manufacturing, air conditioning systems, cleanroom facilities, ventilation equipment, as well as architectural domains encompassing doors, windows, flooring, bathrooms, curtain walls, and prefabricated components. The series excels in providing superior bonding and sealing solutions, setting new industry standards in performance and reliability.

    Production Name Viscosity, dynamic (mPa·s, 25℃)

    HOCMS-2414 28000-38000

    HOCMS-2214 7500-12500

    HOCMS-2606 6500-12000

    HOCMS-2406 6000-9000

    HOCMS-3206 12500-18000

  • Our product series plays a crucial role as a primary intermediate for synthesizing reactive diluents, while also serving as a key raw material for bisphenol A resin and fiberglass binder production. Its extensive applications span across diverse industries, including electronics for computers and mobile devices, semiconductor manufacturing, and specialized fields such as automotive, wind power, and solar cell industries, where it is utilized in the production of high-performance UV-curable inks, coatings, and adhesives.

  • Cleaning Solutions: It can be incorporated into cleaning solutions used for wafer cleaning and surface preparation. Its surfactant properties assist in the removal of contaminants and particles from semiconductor surfaces.

    Photoresist Formulations:It can be used as a component in photoresist formulations. It can enhance the solubility and stability of photoresist materials, leading to improved coating and lithographic processes.

    Wetting Agent: It can act as a wetting agent in various semiconductor processes. It promotes uniform wetting of surfaces, aiding in the adhesion and deposition of materials during fabrication.

    Defoaming Agent: The low-foaming properties can make it suitable for use as a defoaming agent in semiconductor manufacturing processes. It helps control foam generation and can be added to formulations where foam needs to be minimized.

    HOCONIC-348

    HOCONIC-344

  • Our product is classified as an epoxy curing agent with versatile capabilities. It possesses the ability to react with carboxylic acids, resulting in the formation of thermoplastics. Furthermore, it exhibits rapid reactivity with isocyanates, leading to the formation of salts that can serve as effective surfactants.

    It is particularly well-suited for applications in jewelry adhesives, crystal adhesives, curved surface adhesives, and drop adhesives.

  • Our series of products offer exceptional capabilities in controlling foam formation, reducing surface tension, and maintaining viscosity stability. They are specifically designed for application in various industries, including ink, paint, coating, adhesive, pigment manufacturing, pigment dispersion, dye processing, agriculture, cement, and metal processing lubricants. Our products boast superior wetting and defoaming properties, ensuring optimal performance in these fields.

    One of the key advantages of our product line is the absence of harmful octylphenol ethoxylates (APE Free), making them safe for human use and environmentally friendly. Additionally, we can provide comprehensive testing data for over sixty residual compounds.

  • It is used for grafting modified silicone oil to improve the hydrophilicity of silicone oil, or as polyurethane foam stabilizer.